Addressing Manufacturing Issues Due to PCB Land Pattern Recommendations

Recently, we encountered a manufacturing issue related to the recommended PCB land pattern. Upon investigation, we discovered that the datasheet, originally released in 2016, had accurate footprint and datasheet recommendations at the time. However, these recommendations led to manufacturing issues.

The OEM team provided the latest revision of the datasheet for the same part, which included changes in the dimensions of the recommended PCB land pattern.

Root Cause Analysis:
DFM feasibility was not verified, and the 3 mil solder web was not checked.
The IPC standard was not considered, as the ECAD librarian followed the datasheet recommendation due to the part being fine pitch.

Containment Actions:
Created a new PCB footprint and replaced the part.
Identified where the part was used and communicated this information to the entire engineering team.

Corrective Measures:
ECAD librarians should collaborate with cross-functional teams (CE and …

— Article from E-Cad Bridge —